Apple, NEC, HTC in Race for Next Generation Cooling Systems for Smartphones and Beyond

Patently Apple
By Jack PurcherJun 18, 2013, 10:47 pm854 pts
DigiTimes reported today that smartphone players such as Apple, Samsung Electronics and High Tech Computer (HTC) have started showing interest in adopting ultra-thin heat pipes for their smartphones and are expected to release heat pipe-adopted models in the fourth quarter, at the earliest, according to…

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