Kuo: Apple Delays Change Aimed at Saving Space Inside Future iPhones

MacRumors
By Joe RossignolJul 17, 2024, 10:09 am428 pts
Apple no longer plans to use resin-coated copper for logic boards in iPhone 17 models next year, supply chain analyst Ming-Chi Kuo said today. Kuo said resin-coated copper failed to meet Apple's "high-quality requirements," leading to the company scrapping its plans to adopt the material for iPhone 17 models.…

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