iPhone 18's Advanced A20 Chip Packaging Gains Momentum at TSMC

MacRumors
By Tim HardwickJun 23, 2025, 7:03 am193 pts
Next year's iPhone 18 will use TSMC's next-generation 2-nanometer fabrication process in combination with an advanced new packaging method, and the world's leading pure-play foundry has reportedly already established a dedicated production line for Apple in anticipation of mass production in 2026. According to…

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