TSMC plans to open chip packaging plant in Arizona by 2029

MacDailyNews
Apr 22, 2026, 4:24 pm218 ptsTrending
Taiwan Semiconductor Manufacturing Co. (TSMC) plans to open a chip packaging plant in Arizona by 2029, an executive told Reuters. Modern artificial intelligence chips, such as those made by Apple and Nvidia, are not single chips but several chips glued together using advanced packaging technologies. This step…

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